Everspin Technologies - MR256A08BMA35

MR256A08BMA35 by Everspin Technologies

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Manufacturer Everspin Technologies
Manufacturer's Part Number MR256A08BMA35
Description MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Nominal Supply Voltage / Vsup (V): 3.3;
Datasheet MR256A08BMA35 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .007 Amp
Organization: 32KX8
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Maximum Seated Height: 1.35 mm
Minimum Supply Voltage (Vsup): 3 V
Sub-Category: SRAMs
Surface Mount: YES
Maximum Supply Current: 65 mA
No. of Terminals: 48
No. of Words: 32768 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH
Technology: CMOS
JESD-30 Code: S-PBGA-B48
Package Shape: SQUARE
Terminal Form: BALL
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: LFBGA
Width: 8 mm
Memory Density: 262144 bit
Memory IC Type: MEMORY CIRCUIT
Minimum Operating Temperature: 0 Cel
Memory Width: 8
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: BGA48,6X8,30
Length: 8 mm
Maximum Access Time: 35 ns
No. of Words Code: 32K
Nominal Supply Voltage / Vsup (V): 3.3
Peak Reflow Temperature (C): NOT SPECIFIED
Terminal Pitch: .75 mm
Temperature Grade: COMMERCIAL
Maximum Supply Voltage (Vsup): 3.6 V
Power Supplies (V): 3.3
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