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| Manufacturer | Everspin Technologies |
|---|---|
| Manufacturer's Part Number | MR25H10CDF |
| Description | MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; Maximum Operating Temperature: 85 Cel; |
| Datasheet | MR25H10CDF Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .000115 Amp |
| Organization: | 128KX8 |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | .9 mm |
| Minimum Supply Voltage (Vsup): | 2.7 V |
| Sub-Category: | SRAMs |
| Surface Mount: | YES |
| Maximum Supply Current: | 27 mA |
| Terminal Finish: | MATTE TIN |
| No. of Terminals: | 8 |
| No. of Words: | 131072 words |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| Technology: | CMOS |
| JESD-30 Code: | R-PDSO-N8 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | NO LEAD |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | HVSON |
| Width: | 5 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Memory Density: | 1048576 bit |
| Memory IC Type: | MEMORY CIRCUIT |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 8 |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | SOLCC8,.25 |
| Length: | 6 mm |
| No. of Words Code: | 128K |
| Nominal Supply Voltage / Vsup (V): | 3 |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | 1.27 mm |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 3.6 V |
| Power Supplies (V): | 3/3.3 |
