
Image shown is a representation only.
Manufacturer | Everspin Technologies |
---|---|
Manufacturer's Part Number | MR25H256ACDFR |
Description | SPI BUS SERIAL EEPROM; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: HVSON; Package Shape: RECTANGULAR; No. of Words Code: 32K; |
Datasheet | MR25H256ACDFR Datasheet |
NAME | DESCRIPTION |
---|---|
Package Body Material: | PLASTIC/EPOXY |
Organization: | 32KX8 |
Maximum Seated Height: | .9 mm |
Minimum Supply Voltage (Vsup): | 2.7 V |
Surface Mount: | YES |
No. of Terminals: | 8 |
No. of Words: | 32768 words |
Terminal Position: | DUAL |
Package Style (Meter): | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
Technology: | CMOS |
JESD-30 Code: | R-PDSO-N8 |
Package Shape: | RECTANGULAR |
Terminal Form: | NO LEAD |
Operating Mode: | SYNCHRONOUS |
Maximum Operating Temperature: | 85 Cel |
Package Code: | HVSON |
Width: | 5 mm |
Moisture Sensitivity Level (MSL): | 3 |
Memory Density: | 262144 bit |
Memory IC Type: | SPI BUS SERIAL EEPROM |
Minimum Operating Temperature: | -40 Cel |
Memory Width: | 8 |
No. of Functions: | 1 |
Length: | 6 mm |
No. of Words Code: | 32K |
Nominal Supply Voltage / Vsup (V): | 3 |
Terminal Pitch: | 1.27 mm |
Temperature Grade: | INDUSTRIAL |
Maximum Supply Voltage (Vsup): | 3.6 V |