MR4A16BCMA35R by Everspin Technologies | Memory ICs

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Manufacturer	Everspin Technologies
Manufacturer's Part Number	MR4A16BCMA35R
Description	MRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 48; Package Code: LFBGA; Package Shape: SQUARE; Peak Reflow Temperature (C): NOT SPECIFIED;
Datasheet	MR4A16BCMA35R Datasheet

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.009 Amp
Organization:	1MX16
Maximum Time At Peak Reflow Temperature (s):	NOT SPECIFIED
Maximum Seated Height:	1.35 mm
Minimum Supply Voltage (Vsup):	3 V
Sub-Category:	SRAMs
Surface Mount:	YES
Maximum Supply Current:	180 mA
Maximum Write Cycle Time (tWC):	.000035 ms
No. of Terminals:	48
No. of Words:	1048576 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, LOW PROFILE, FINE PITCH
Technology:	CMOS
JESD-30 Code:	S-PBGA-B48
Package Shape:	SQUARE
Terminal Form:	BALL
Operating Mode:	ASYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Package Code:	LFBGA
Width:	10 mm
Memory Density:	16777216 bit
Minimum Standby Voltage:	3 V
Memory IC Type:	MRAM
Minimum Operating Temperature:	-40 Cel
Memory Width:	16
No. of Functions:	1
Qualification:	Not Qualified
Package Equivalence Code:	BGA48,6X8,30
Length:	10 mm
Maximum Access Time:	35 ns
No. of Words Code:	1M
Nominal Supply Voltage / Vsup (V):	3.3
Minimum Data Retention Time:	20
Peak Reflow Temperature (C):	NOT SPECIFIED
Parallel or Serial:	PARALLEL
Terminal Pitch:	.75 mm
Temperature Grade:	INDUSTRIAL
Maximum Supply Voltage (Vsup):	3.6 V
Power Supplies (V):	3.3

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