Flexxon Global - FEMC032GTTE7-T14-20

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FEMC032GTTE7-T14-20 by Flexxon Global

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Manufacturer Flexxon Global
Manufacturer's Part Number FEMC032GTTE7-T14-20
Description FLASH CARD; Temperature Grade: INDUSTRIAL; No. of Terminals: 153; Package Code: BGA; Package Shape: RECTANGULAR; Memory Density: 274877906944 bit;
Datasheet FEMC032GTTE7-T14-20 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 32GX8
Programming Voltage (V): 3.3
Surface Mount: YES
No. of Terminals: 153
No. of Words: 34359738368 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: R-PBGA-B153
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: BGA
Memory Density: 274877906944 bit
Memory IC Type: FLASH CARD
Minimum Operating Temperature: -40 Cel
Memory Width: 8
No. of Functions: 1
Type: MLC NAND TYPE
No. of Words Code: 32G
Nominal Supply Voltage / Vsup (V): 3.3
Parallel or Serial: PARALLEL
Temperature Grade: INDUSTRIAL
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