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Manufacturer | Freescale Semiconductor |
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Manufacturer's Part Number | KMC68EN360VR25VL |
Description | SERIAL IO/COMMUNICATION CONTROLLER, LAN; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; |
Datasheet | KMC68EN360VR25VL Datasheet |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 2.7 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 3 V |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Maximum Seated Height: | 1.86 mm |
Surface Mount: | YES |
Terminal Finish: | Tin/Silver/Copper (Sn/Ag/Cu) |
Data Encoding or Decoding Method: | NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM0); BIPH-LEVEL(MANCHESTER); DIFF BIPH-LEVEL |
No. of Terminals: | 357 |
No. of Serial I/Os: | 4 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Address Bus Width: | 32 |
Maximum Data Transfer Rate: | 1.25 MBps |
Technology: | HCMOS |
JESD-30 Code: | S-PBGA-B357 |
Maximum Clock Frequency: | 25 MHz |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Maximum Operating Temperature: | 70 Cel |
Package Code: | BGA |
Width: | 25 mm |
Moisture Sensitivity Level (MSL): | 3 |
Peripheral IC Type: | SERIAL IO/COMMUNICATION CONTROLLER, LAN |
Maximum Supply Voltage: | 3.3 V |
Low Power Mode: | YES |
Boundary Scan: | YES |
External Data Bus Width: | 32 |
Communication Protocol: | ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | 0 Cel |
Qualification: | Not Qualified |
Length: | 25 mm |
Peak Reflow Temperature (C): | 260 |
Bus Compatibility: | 68000 |
Terminal Pitch: | 1.27 mm |
Temperature Grade: | COMMERCIAL |