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| Manufacturer | Freescale Semiconductor |
|---|---|
| Manufacturer's Part Number | LS1021AXN7KQB |
| Description | MICROPROCESSOR CIRCUIT; Terminal Form: BALL; No. of Terminals: 525; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG; |
| Datasheet | LS1021AXN7KQB Datasheet |
| In Stock | 84 |
| NAME | DESCRIPTION |
|---|---|
| Minimum Supply Voltage: | .97 V |
| Package Body Material: | PLASTIC/EPOXY |
| Peripheral IC Type: | MICROPROCESSOR CIRCUIT |
| Nominal Supply Voltage: | 1 V |
| Maximum Supply Voltage: | 1.03 V |
| Maximum Seated Height: | 2.07 mm |
| Surface Mount: | YES |
| No. of Terminals: | 525 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG |
| Length: | 19 mm |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B525 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Package Code: | HBGA |
| Width: | 19 mm |
| Terminal Pitch: | .8 mm |








