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| Manufacturer | Freescale Semiconductor |
|---|---|
| Manufacturer's Part Number | MCF5212LCVM66J |
| Description | Microcontrollers; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 81; Package Code: BGA; Package Shape: SQUARE; |
| Datasheet | MCF5212LCVM66J Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Time At Peak Reflow Temperature (s): | 40 |
| Sub-Category: | Microcontrollers |
| Surface Mount: | YES |
| Terminal Finish: | TIN SILVER COPPER OVER NICKEL |
| No. of Terminals: | 81 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B81 |
| Package Shape: | SQUARE |
| ROM Words: | 262144 |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | BGA |
| Moisture Sensitivity Level (MSL): | 3 |
| Speed: | 66 rpm |
| RAM Bytes: | 32768 |
| Bit Size: | 32 |
| Minimum Operating Temperature: | -40 Cel |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA81,9X9,40 |
| Peak Reflow Temperature (C): | 260 |
| ROM Programmability: | FLASH |
| Terminal Pitch: | 1 mm |
| Temperature Grade: | INDUSTRIAL |
| Power Supplies (V): | 3/3.3,3.3 |
| CPU Family: | COLDFIRE |
