
Image shown is a representation only.
Manufacturer | Freescale Semiconductor |
---|---|
Manufacturer's Part Number | MCF52258CVN66J |
Description | Microcontrollers; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 144; Package Code: BGA; Package Shape: SQUARE; |
Datasheet | MCF52258CVN66J Datasheet |
NAME | DESCRIPTION |
---|---|
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 3.3 V |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Sub-Category: | Microcontrollers |
Surface Mount: | YES |
No. of Terminals: | 144 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B144 |
Package Shape: | SQUARE |
ROM Words: | 524288 |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | BGA |
Moisture Sensitivity Level (MSL): | 3 |
Speed: | 66 rpm |
RAM Bytes: | 65536 |
Bit Size: | 32 |
JESD-609 Code: | e2 |
Minimum Operating Temperature: | -40 Cel |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA144,12X12,40 |
Peak Reflow Temperature (C): | 260 |
ROM Programmability: | FLASH |
Terminal Pitch: | 1 mm |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 3.3 |
CPU Family: | COLDFIRE |