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Manufacturer | Freescale Semiconductor |
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Manufacturer's Part Number | MCF5282CVF66J |
Description | Microcontrollers; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: BGA; Package Shape: SQUARE; |
Datasheet | MCF5282CVF66J Datasheet |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Sub-Category: | Microcontrollers |
Surface Mount: | YES |
Maximum Supply Current: | 200 mA |
Terminal Finish: | TIN LEAD SILVER |
No. of Terminals: | 256 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B256 |
Package Shape: | SQUARE |
ROM Words: | 524288 |
Terminal Form: | BALL |
Maximum Operating Temperature: | 85 Cel |
Package Code: | BGA |
Moisture Sensitivity Level (MSL): | 3 |
Speed: | 66 rpm |
RAM Bytes: | 65536 |
Bit Size: | 32 |
JESD-609 Code: | e0 |
Minimum Operating Temperature: | -40 Cel |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA256,16X16,40 |
Peak Reflow Temperature (C): | 220 |
ROM Programmability: | FLASH |
Terminal Pitch: | 1 mm |
Temperature Grade: | INDUSTRIAL |
Power Supplies (V): | 3/3.3 |
CPU Family: | COLDFIRE |