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Manufacturer | Freescale Semiconductor |
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Manufacturer's Part Number | MCIMX535DVV1CR2 |
Description | Multifunction Peripherals; Terminal Form: BALL; No. of Terminals: 529; Package Code: HBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG; |
Datasheet | MCIMX535DVV1CR2 Datasheet |
In Stock | 578 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 1.2 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1.25 V |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Maximum Supply Voltage: | 1.4 V |
Maximum Seated Height: | 1.85 mm |
Surface Mount: | YES |
Terminal Finish: | Tin/Silver (Sn/Ag) |
JESD-609 Code: | e2 |
No. of Terminals: | 529 |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG |
Length: | 19 mm |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B529 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Peak Reflow Temperature (C): | 260 |
Package Code: | HBGA |
Width: | 19 mm |
Terminal Pitch: | .8 mm |
Moisture Sensitivity Level (MSL): | 3 |