Freescale Semiconductor - MCIMX6X1EVK10AB

MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 388; Package Code: BGA; Package Shape: SQUARE;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Terminal Finish: Tin/Lead (Sn/Pb);

NXP Semiconductors' SPC5125YVN400R is a 32-bit microprocessor with 324 terminals in a grid array package. Operating at temperatures from -40 to 85°C, it features power supplies of 1.4V and 3.3V, making it ideal for industrial applications requiring high-speed processing capabilities. The device is designed for surface mount assembly and has a moisture sensitivity level of MSL3, meeting AEC-Q100 standards.

NXP Semiconductors' MCF54451CVM180 microprocessor features 32-bit address and external data bus width, with a max clock frequency of 60 MHz. Ideal for industrial applications, it operates at temperatures ranging from -40 to 85 °C and offers low power mode for efficient performance.

MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 480; Package Code: LBGA; Package Shape: SQUARE;

NXP Semiconductors' MPC860TCZQ66D4 microprocessor features 32-bit address and external data bus width, with a max clock frequency of 50 MHz. Ideal for low power applications, it operates at a speed of 66 rpm and supports integrated cache memory. Suitable for various embedded systems requiring high processing capabilities.

MICROPROCESSOR, RISC;

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 245;

XAM5749ABZXEA by Texas Instruments is a microprocessor with integrated cache and a max clock frequency of 38.4 MHz. It has a square package, with 760 terminals and a low profile design. This microprocessor is commonly used in industrial applications due to its temperature grade and CMOS technology.

MICROPROCESSOR, RISC; Moisture Sensitivity Level (MSL): 3; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER; Technology: CMOS;

MICROPROCESSOR, RISC; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;

APX81131UG-7 by Diodes Incorporated is a small outline microprocessor with 4 terminals, operating b/w -40 to 85°C. It has a supply voltage range of 1.1V to 5.5V and uses CMOS technology for industrial applications requiring fixed-point processing in compact spaces.

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE; Terminal Pitch: .8 mm;

MICROCONTROLLER, RISC; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;

AM3357BZCZA30 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words and 16-bit external data bus width. It operates at a max clock frequency of 26 MHz, suitable for industrial applications requiring low power mode and boundary scan capability. With a terminal pitch of 0.8 mm and package style of grid array, it offers high performance in compact designs.

Renesas Electronics R7S721020VLFP#AA1 microprocessor features 32-bit external data bus, 8KB integrated cache, and 26-bit address bus width. Ideal for low power applications with a max clock frequency of 13.33 MHz. Suitable for use in embedded systems requiring high-speed processing and low power consumption.

MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 272; Package Code: BGA; Package Shape: SQUARE;

STM32MP135FAE7 by STMicroelectronics is a 32-bit microprocessor with integrated cache and 172032 RAM words. It operates at a max clock frequency of 48 MHz, suitable for low power applications like IoT devices and wearables. With 289 terminals in a grid array package style, it offers high performance in a compact form factor.

MICROPROCESSOR; Peak Reflow Temperature (C): 260; Maximum Time At Peak Reflow Temperature (s): 40; Moisture Sensitivity Level (MSL): 3;