Image shown is a representation only.
| Manufacturer | Freescale Semiconductor |
|---|---|
| Manufacturer's Part Number | MPC556LFMZP40 |
| Description | Microcontrollers; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 272; Package Code: BGA; Package Shape: SQUARE; |
| Datasheet | MPC556LFMZP40 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Speed: | 40 rpm |
| RAM Bytes: | 26624 |
| Sub-Category: | Microcontrollers |
| Surface Mount: | YES |
| Bit Size: | 32 |
| Maximum Supply Current: | 22 mA |
| Minimum Operating Temperature: | -40 Cel |
| No. of Terminals: | 272 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | BGA272,20X20,50 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B272 |
| Package Shape: | SQUARE |
| ROM Words: | 458752 |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 125 Cel |
| Package Code: | BGA |
| ROM Programmability: | FLASH |
| Terminal Pitch: | 1.27 mm |
| Temperature Grade: | AUTOMOTIVE |
| Power Supplies (V): | 3.3,5 |
