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Manufacturer | Freescale Semiconductor |
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Manufacturer's Part Number | MPC8569EVTAUNLB |
Description | MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 783; Package Code: HBGA; Package Shape: SQUARE; Format: FLOATING POINT; |
Datasheet | MPC8569EVTAUNLB Datasheet |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | 1.067 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1.1 V |
Integrated Cache: | YES |
Maximum Time At Peak Reflow Temperature (s): | 30 |
Maximum Seated Height: | 3.94 mm |
Sub-Category: | Microprocessors |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER OVER NICKEL |
No. of Terminals: | 783 |
Terminal Position: | BOTTOM |
Format: | FLOATING POINT |
Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG |
Address Bus Width: | 16 |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B783 |
Maximum Clock Frequency: | 133 MHz |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Package Code: | HBGA |
Width: | 29 mm |
Moisture Sensitivity Level (MSL): | 3 |
Speed: | 1333 rpm |
Peripheral IC Type: | MICROPROCESSOR, RISC |
Maximum Supply Voltage: | 1.133 V |
Low Power Mode: | YES |
Boundary Scan: | YES |
External Data Bus Width: | 64 |
Bit Size: | 32 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA783,28X28,40 |
Length: | 29 mm |
Peak Reflow Temperature (C): | 245 |
Terminal Pitch: | 1 mm |
Power Supplies (V): | 1.1,2.5/3.3 |