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Manufacturer | Freescale Semiconductor |
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Manufacturer's Part Number | P1010NXE5HFA |
Description | MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 425; Package Code: FBGA; Package Shape: SQUARE; Terminal Pitch: .8 mm; |
Datasheet | P1010NXE5HFA Datasheet |
In Stock | 1 |
NAME | DESCRIPTION |
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Minimum Supply Voltage: | .95 V |
Package Body Material: | PLASTIC/EPOXY |
Nominal Supply Voltage: | 1 V |
Integrated Cache: | YES |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Maximum Seated Height: | 1.9 mm |
Sub-Category: | Microprocessors |
Surface Mount: | YES |
No. of Terminals: | 425 |
Terminal Position: | BOTTOM |
Format: | FLOATING POINT |
Package Style (Meter): | GRID ARRAY, FINE PITCH |
Address Bus Width: | 0 |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B425 |
Maximum Clock Frequency: | 100 MHz |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Package Code: | FBGA |
Width: | 19 mm |
Moisture Sensitivity Level (MSL): | 3 |
Speed: | 800 rpm |
Peripheral IC Type: | MICROPROCESSOR, RISC |
Maximum Supply Voltage: | 1.05 V |
Low Power Mode: | YES |
Boundary Scan: | YES |
External Data Bus Width: | 0 |
Bit Size: | 32 |
JESD-609 Code: | e2 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA425,23X23,32 |
Length: | 19 mm |
Peak Reflow Temperature (C): | 260 |
Terminal Pitch: | .8 mm |
Power Supplies (V): | 1 |