Fujitsu Semiconductor America - MB85R256FPFCN-G-BNDE1

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MB85R256FPFCN-G-BNDE1 by Fujitsu Semiconductor America

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Manufacturer Fujitsu Semiconductor America
Manufacturer's Part Number MB85R256FPFCN-G-BNDE1
Description FRAM; No. of Terminals: 28; Package Code: TSOP1; Package Shape: RECTANGULAR; Package Equivalence Code: TSSOP28,.53,22; Surface Mount: YES;
Datasheet MB85R256FPFCN-G-BNDE1 Datasheet
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 32KX8
Maximum Seated Height: 1.2 mm
Minimum Supply Voltage (Vsup): 2.7 V
Surface Mount: YES
No. of Terminals: 28
No. of Words: 32768 words
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, THIN PROFILE
Technology: CMOS
JESD-30 Code: R-PDSO-G28
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Operating Mode: ASYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Endurance: 1000000000000 Write/Erase Cycles
Package Code: TSOP1
Width: 8 mm
Memory Density: 262144 bit
Minimum Standby Voltage: 2.7 V
Memory IC Type: FRAM
Minimum Operating Temperature: -40 Cel
Memory Width: 8
No. of Functions: 1
Qualification: Not Qualified
Package Equivalence Code: TSSOP28,.53,22
Length: 11.8 mm
No. of Words Code: 32K
Nominal Supply Voltage / Vsup (V): 3.3
Minimum Data Retention Time: 10
Parallel or Serial: PARALLEL
Terminal Pitch: .55 mm
Maximum Supply Voltage (Vsup): 3.6 V
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