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| Manufacturer | Fujitsu |
|---|---|
| Manufacturer's Part Number | MB89R118C1-DIAP15-P1 |
| Description | FRAM-EMBEDDED; Package Code: DIE; Package Shape: UNSPECIFIED; Terminal Position: UPPER; Package Body Material: UNSPECIFIED; Additional Features: DATA RETENTION TIME @ 85 DEGREE CENTIGRADE; |
| Datasheet | MB89R118C1-DIAP15-P1 Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | UNSPECIFIED |
| Memory Density: | 16384 bit |
| Organization: | 2KX8 |
| Surface Mount: | YES |
| Memory IC Type: | FRAM-EMBEDDED |
| Minimum Operating Temperature: | -20 Cel |
| Memory Width: | 8 |
| No. of Functions: | 1 |
| No. of Words: | 2048 words |
| Package Equivalence Code: | DIE OR CHIP |
| Terminal Position: | UPPER |
| Package Style (Meter): | UNCASED CHIP |
| Technology: | CMOS |
| No. of Words Code: | 2K |
| JESD-30 Code: | X-XUUC-N |
| Package Shape: | UNSPECIFIED |
| Terminal Form: | NO LEAD |
| Additional Features: | DATA RETENTION TIME @ 85 DEGREE CENTIGRADE |
| Minimum Data Retention Time: | 10 |
| Maximum Operating Temperature: | 85 Cel |
| Endurance: | 1000000000000 Write/Erase Cycles |
| Package Code: | DIE |
