Fujitsu - MB89R118C1-DIAP15-P1

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MB89R118C1-DIAP15-P1 by Fujitsu

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Manufacturer Fujitsu
Manufacturer's Part Number MB89R118C1-DIAP15-P1
Description FRAM-EMBEDDED; Package Code: DIE; Package Shape: UNSPECIFIED; Terminal Position: UPPER; Package Body Material: UNSPECIFIED; Additional Features: DATA RETENTION TIME @ 85 DEGREE CENTIGRADE;
Datasheet MB89R118C1-DIAP15-P1 Datasheet
NAME DESCRIPTION
Package Body Material: UNSPECIFIED
Memory Density: 16384 bit
Organization: 2KX8
Surface Mount: YES
Memory IC Type: FRAM-EMBEDDED
Minimum Operating Temperature: -20 Cel
Memory Width: 8
No. of Functions: 1
No. of Words: 2048 words
Package Equivalence Code: DIE OR CHIP
Terminal Position: UPPER
Package Style (Meter): UNCASED CHIP
Technology: CMOS
No. of Words Code: 2K
JESD-30 Code: X-XUUC-N
Package Shape: UNSPECIFIED
Terminal Form: NO LEAD
Additional Features: DATA RETENTION TIME @ 85 DEGREE CENTIGRADE
Minimum Data Retention Time: 10
Maximum Operating Temperature: 85 Cel
Endurance: 1000000000000 Write/Erase Cycles
Package Code: DIE
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