
Image shown is a representation only.
Manufacturer | Gigadevice Semiconductor |
---|---|
Manufacturer's Part Number | GD32E230K8U6 |
Description | MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE; |
Datasheet | GD32E230K8U6 Datasheet |
NAME | DESCRIPTION |
---|---|
Minimum Supply Voltage: | 1.8 V |
Package Body Material: | UNSPECIFIED |
Integrated Cache: | NO |
Surface Mount: | YES |
On Chip Data RAM Width: | 8 |
No. of DMA Channels: | 5 |
Address Bus Width: | 0 |
Technology: | CMOS |
RAM Words: | 8192 |
Maximum Clock Frequency: | 50 MHz |
Package Shape: | SQUARE |
Terminal Form: | NO LEAD |
Package Code: | HVQCCN |
No. of External Interrupts: | 16 |
Bit Size: | 32 |
DAC Channels: | NO |
Package Equivalence Code: | LCC32,.2SQ,20 |
PWM Channels: | YES |
Connectivity: | I2C(2), I2S, SPI(2), USART(2) |
ROM Programmability: | FLASH |
Analog To Digital Convertors: | 10-Ch 12-Bit |
Terminal Pitch: | .5 mm |
CPU Family: | CORTEX-M23 |
Nominal Supply Voltage: | 3.3 V |
Maximum Seated Height: | .8 mm |
ADC Channels: | YES |
No. of Terminals: | 32 |
No. of Timers: | 7 |
No. of Serial I/Os: | 2 |
DMA Channels: | YES |
Terminal Position: | QUAD |
Format: | FIXED POINT |
Package Style (Meter): | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
No. of I/O Lines: | 27 |
JESD-30 Code: | S-XQCC-N32 |
ROM Words: | 65536 |
Maximum Operating Temperature: | 85 Cel |
Width: | 5 mm |
Data EEPROM Size: | 0 |
Speed: | 72 rpm |
Peripheral IC Type: | MICROCONTROLLER, RISC |
Maximum Supply Voltage: | 3.6 V |
RAM Bytes: | 8192 |
Low Power Mode: | YES |
Boundary Scan: | NO |
External Data Bus Width: | 0 |
Peripherals: | COMPARATOR, POR, RTC, TIMER(7), WDT(2) |
Minimum Operating Temperature: | -40 Cel |
Length: | 5 mm |
On Chip Program ROM Width: | 8 |
Temperature Grade: | INDUSTRIAL |