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| Manufacturer | Harris Semiconductor |
|---|---|
| Manufacturer's Part Number | HS1-6664RH-Q |
| Description | OTP ROM; Temperature Grade: MILITARY; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Operating Temperature: 125 Cel; |
| Datasheet | HS1-6664RH-Q Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | CERAMIC, METAL-SEALED COFIRED |
| Maximum Standby Current: | .0005 Amp |
| Organization: | 8KX8 |
| Output Characteristics: | 3-STATE |
| Sub-Category: | OTP ROMs |
| Surface Mount: | NO |
| Maximum Supply Current: | 15 mA |
| Terminal Finish: | Tin/Lead (Sn/Pb) |
| No. of Terminals: | 28 |
| No. of Words: | 8192 words |
| Terminal Position: | DUAL |
| Package Style (Meter): | IN-LINE |
| Screening Level: | 38535V;38534K;883S |
| Technology: | CMOS |
| JESD-30 Code: | R-CDIP-T28 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | THROUGH-HOLE |
| Operating Mode: | ASYNCHRONOUS |
| Maximum Operating Temperature: | 125 Cel |
| Package Code: | DIP |
| Memory Density: | 65536 bit |
| Memory IC Type: | OTP ROM |
| JESD-609 Code: | e0 |
| Minimum Operating Temperature: | -55 Cel |
| Memory Width: | 8 |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | DIP28,.6 |
| Maximum Access Time: | 65 ns |
| No. of Words Code: | 8K |
| Nominal Supply Voltage / Vsup (V): | 5 |
| Additional Features: | RADIATION-HARDENED PROM |
| Parallel or Serial: | PARALLEL |
| Terminal Pitch: | 2.54 mm |
| Temperature Grade: | MILITARY |
| Power Supplies (V): | 5 |
