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| Manufacturer | Holtek Semiconductor |
|---|---|
| Manufacturer's Part Number | HT24LC64(8DIP) |
| Description | EEPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Terminal Form: THROUGH-HOLE; |
| Datasheet | HT24LC64(8DIP) Datasheet |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .000004 Amp |
| Organization: | 8KX8 |
| Sub-Category: | EEPROMs |
| Surface Mount: | NO |
| Maximum Supply Current: | 5 mA |
| No. of Terminals: | 8 |
| I2C Control Byte: | 1010DDDR |
| No. of Words: | 8192 words |
| Terminal Position: | DUAL |
| Package Style (Meter): | IN-LINE |
| Write Protection: | HARDWARE |
| Technology: | CMOS |
| JESD-30 Code: | R-PDIP-T8 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | THROUGH-HOLE |
| Maximum Operating Temperature: | 70 Cel |
| Endurance: | 1000000 Write/Erase Cycles |
| Package Code: | DIP |
| Serial Bus Type: | I2C |
| Memory Density: | 65536 bit |
| Memory IC Type: | EEPROM |
| Minimum Operating Temperature: | 0 Cel |
| Memory Width: | 8 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | DIP8,.3 |
| No. of Words Code: | 8K |
| Minimum Data Retention Time: | 40 |
| Parallel or Serial: | SERIAL |
| Terminal Pitch: | 2.54 mm |
| Temperature Grade: | COMMERCIAL |
| Power Supplies (V): | 2.5/5 |
