5962R1821401VXF by Infineon Technologies | Memory ICs

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Manufacturer	Infineon Technologies
Manufacturer's Part Number	5962R1821401VXF
Description	QDR II SRAM; No. of Terminals: 165; Package Code: CGA; Package Shape: RECTANGULAR; Maximum Supply Voltage (Vsup): 1.9 V; Memory Density: 150994944 bit;
Datasheet	5962R1821401VXF Datasheet
In Stock	558

NAME	DESCRIPTION
Package Body Material:	CERAMIC, METAL-SEALED COFIRED
Maximum Standby Current:	.36 Amp
Organization:	8MX18
Maximum Seated Height:	5.38 mm
Minimum Supply Voltage (Vsup):	1.7 V
Surface Mount:	YES
Maximum Supply Current:	900 mA
Terminal Finish:	Tin/Lead (Sn/Pb)
No. of Terminals:	165
Total Dose (V):	200k Rad(Si)
Maximum Clock Frequency (fCLK):	250 MHz
No. of Words:	8388608 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Screening Level:	MIL-PRF-38535 Class V
Technology:	CMOS
JESD-30 Code:	R-CBGA-X165
Package Shape:	RECTANGULAR
Terminal Form:	UNSPECIFIED
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	125 Cel
Package Code:	CGA
Width:	21 mm
Moisture Sensitivity Level (MSL):	1
Input/Output Type:	COMMON
Memory Density:	150994944 bit
Minimum Standby Voltage:	1.7 V
Memory IC Type:	QDR II SRAM
JESD-609 Code:	e0
Minimum Operating Temperature:	-55 Cel
Memory Width:	18
Output Enable:	NO
No. of Functions:	1
Qualification:	Not Qualified
Package Equivalence Code:	CGA165,11X15,50
Length:	25 mm
No. of Words Code:	8M
Nominal Supply Voltage / Vsup (V):	1.8
Parallel or Serial:	PARALLEL
Terminal Pitch:	1.27 mm
Maximum Supply Voltage (Vsup):	1.9 V

Pricing (USD)

Qty.	Unit Price	Ext. Price
558	-	-

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