Infineon Technologies - AM49DL324BGB70IS

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AM49DL324BGB70IS by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number AM49DL324BGB70IS
Description MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 73; Package Code: FBGA; Package Shape: RECTANGULAR; Mixed Memory Type: FLASH+PSRAM;
Datasheet AM49DL324BGB70IS Datasheet
In Stock609
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .000005 Amp
Sub-Category: Other Memory ICs
Surface Mount: YES
Maximum Supply Current: 40 mA
Terminal Finish: TIN LEAD
No. of Terminals: 73
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, FINE PITCH
Technology: CMOS
JESD-30 Code: R-PBGA-B73
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: FBGA
Moisture Sensitivity Level (MSL): 3
Mixed Memory Type: FLASH+PSRAM
Memory IC Type: MEMORY CIRCUIT
JESD-609 Code: e0
Minimum Operating Temperature: -40 Cel
Qualification: Not Qualified
Package Equivalence Code: BGA73,10X12,32
Maximum Access Time: 70 ns
Nominal Supply Voltage / Vsup (V): 3
Peak Reflow Temperature (C): 260
Terminal Pitch: .8 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 3
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