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| Manufacturer | Infineon Technologies |
|---|---|
| Manufacturer's Part Number | BCM43241DKFFBG |
| Description | TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 208; Package Code: TFBGA; Package Shape: RECTANGULAR; |
| Datasheet | BCM43241DKFFBG Datasheet |
| In Stock | 918 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 1.2 V |
| Telecom IC Type: | TELECOM CIRCUIT |
| Maximum Seated Height: | 1.05 mm |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -30 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 208 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, THIN PROFILE, FINE PITCH |
| Length: | 9 mm |
| JESD-30 Code: | R-PBGA-B208 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | TFBGA |
| Width: | 7 mm |
| Terminal Pitch: | .4 mm |
| Temperature Grade: | OTHER |
