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| Manufacturer | Infineon Technologies |
|---|---|
| Manufacturer's Part Number | BGA5L1BN6E6327XTSA1 |
| Description | TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 6; Package Code: BCC; Package Shape: RECTANGULAR; |
| Datasheet | BGA5L1BN6E6327XTSA1 Datasheet |
| In Stock | 667 |
| NAME | DESCRIPTION |
|---|---|
| Other Names: |
SP001685180 BGA5L1BN6E6327XTSA1DKR BGA5L1BN6E6327XTSA1CT BGA5L1BN6E6327XTSA1-ND BGA5L1BN6E6327XTSA1TR |
| Package Body Material: | UNSPECIFIED |
| Nominal Supply Voltage: | 1.8 V |
| Telecom IC Type: | TELECOM CIRCUIT |
| Maximum Seated Height: | .4 mm |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 6 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | CHIP CARRIER |
| Length: | 1.1 mm |
| JESD-30 Code: | R-XBCC-B6 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BUTT |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | BCC |
| Width: | .7 mm |
| Terminal Pitch: | .4 mm |
| Temperature Grade: | INDUSTRIAL |
| Moisture Sensitivity Level (MSL): | 1 |
