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| Manufacturer | Infineon Technologies |
|---|---|
| Manufacturer's Part Number | BGA713L7E6327XTSA1 |
| Description | RF AND BASEBAND CIRCUIT; Temperature Grade: OTHER; Terminal Form: BUTT; No. of Terminals: 6; Package Code: HVBCC; Package Shape: RECTANGULAR; |
| Datasheet | BGA713L7E6327XTSA1 Datasheet |
| In Stock | 229 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | UNSPECIFIED |
| Nominal Supply Voltage: | 2.8 V |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Telecom IC Type: | RF AND BASEBAND CIRCUIT |
| Maximum Seated Height: | .5 mm |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -30 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 6 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Length: | 2 mm |
| JESD-30 Code: | R-XBCC-B6 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BUTT |
| Maximum Operating Temperature: | 85 Cel |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Package Code: | HVBCC |
| Width: | 1.3 mm |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | OTHER |
