Infineon Technologies - BGA725L6E6327FTSA1

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BGA725L6E6327FTSA1 by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number BGA725L6E6327FTSA1
Description BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 6; Package Code: BCC; Package Shape: RECTANGULAR;
Datasheet BGA725L6E6327FTSA1 Datasheet
In Stock36,952
NAME DESCRIPTION
Other Names: BGA 725L6 E6327DKR-ND
BGA725L6E6327FTSA1CT
BGA 725L6 E6327CT
BGA725L6E6327FTSA1TR
BGA 725L6 E6327TR
BGA725L6E6327
BGA 725L6 E6327CT-ND
BGA 725L6 E6327
SP000942752
BGA 725L6 E6327DKR
BGA725L6E6327FTSA1DKR
BGA 725L6 E6327TR-ND
Package Body Material: UNSPECIFIED
Nominal Supply Voltage: 1.8 V
Telecom IC Type: BASEBAND CIRCUIT
Maximum Seated Height: .4 mm
Surface Mount: YES
Terminal Finish: GOLD
JESD-609 Code: e4
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
No. of Terminals: 6
Terminal Position: BOTTOM
Package Style (Meter): CHIP CARRIER
Length: 1.1 mm
JESD-30 Code: R-XBCC-B6
Package Shape: RECTANGULAR
Terminal Form: BUTT
Maximum Operating Temperature: 85 Cel
Package Code: BCC
Width: .7 mm
Terminal Pitch: .2 mm
Temperature Grade: INDUSTRIAL
Moisture Sensitivity Level (MSL): 1
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