Infineon Technologies - BGA735L16E6327XTSA1

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BGA735L16E6327XTSA1 by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number BGA735L16E6327XTSA1
Description RF FRONT END CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HVQCCN; Package Shape: SQUARE;
Datasheet BGA735L16E6327XTSA1 Datasheet
In Stock581
NAME DESCRIPTION
Package Body Material: UNSPECIFIED
Nominal Supply Voltage: 2.8 V
Telecom IC Type: RF FRONT END CIRCUIT
Maximum Seated Height: .4 mm
Surface Mount: YES
Minimum Operating Temperature: -30 Cel
No. of Functions: 1
No. of Terminals: 16
Terminal Position: QUAD
Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Length: 2.3 mm
JESD-30 Code: S-XQCC-N16
Package Shape: SQUARE
Terminal Form: NO LEAD
Maximum Operating Temperature: 85 Cel
Package Code: HVQCCN
Width: 2.3 mm
Terminal Pitch: .5 mm
Temperature Grade: OTHER
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