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| Manufacturer | Infineon Technologies |
|---|---|
| Manufacturer's Part Number | BGM1044N7E6327XUSA1 |
| Description | RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 6; Package Code: HVSON; Package Shape: RECTANGULAR; |
| Datasheet | BGM1044N7E6327XUSA1 Datasheet |
| In Stock | 825 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 2.7 V |
| Telecom IC Type: | RF AND BASEBAND CIRCUIT |
| Maximum Seated Height: | .77 mm |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 6 |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| Length: | 2.3 mm |
| JESD-30 Code: | R-PDSO-N6 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | NO LEAD |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | HVSON |
| Width: | 1.7 mm |
| Terminal Pitch: | .54 mm |
| Temperature Grade: | INDUSTRIAL |
