Infineon Technologies - BGM15LA12E6327

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BGM15LA12E6327 by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number BGM15LA12E6327
Description TELECOM CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 12; Package Code: BCC; Package Shape: RECTANGULAR;
Datasheet BGM15LA12E6327 Datasheet
In Stock840
NAME DESCRIPTION
Package Body Material: UNSPECIFIED
Nominal Supply Voltage: 2.8 V
Telecom IC Type: TELECOM CIRCUIT
Maximum Seated Height: .65 mm
Surface Mount: YES
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
No. of Terminals: 12
Terminal Position: BOTTOM
Package Style (Meter): CHIP CARRIER
Length: 1.9 mm
JESD-30 Code: R-XBCC-B12
Package Shape: RECTANGULAR
Terminal Form: BUTT
Maximum Operating Temperature: 85 Cel
Package Code: BCC
Width: 1.1 mm
Terminal Pitch: .4 mm
Temperature Grade: INDUSTRIAL
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