Infineon Technologies - BGM681L11E6327XUSA1

BGM681L11E6327XUSA1 by Infineon Technologies

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Manufacturer	Infineon Technologies
Manufacturer's Part Number	BGM681L11E6327XUSA1
Description	TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 11; Package Code: DIE; Package Shape: SQUARE; Maximum Seated Height: .65 mm;
Datasheet	BGM681L11E6327XUSA1 Datasheet
In Stock	793

BGM681L11E6327XUSA1 Technical Details

NAME	DESCRIPTION
Package Body Material:	UNSPECIFIED
Nominal Supply Voltage:	2.8 V
Telecom IC Type:	TELECOM CIRCUIT
Maximum Seated Height:	.65 mm
Surface Mount:	YES
No. of Functions:	1
No. of Terminals:	11
Terminal Position:	UPPER
Package Style (Meter):	UNCASED CHIP
Length:	2.5 mm
JESD-30 Code:	S-XUUC-N11
Package Shape:	SQUARE
Terminal Form:	NO LEAD
Package Code:	DIE
Width:	2.5 mm

Pricing (USD)

Qty.	Unit Price	Ext. Price
793	$2.160	$1,712.880

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