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| Manufacturer | Infineon Technologies |
|---|---|
| Manufacturer's Part Number | BGM681L11E6327XUSA1 |
| Description | TELECOM CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 11; Package Code: DIE; Package Shape: SQUARE; Maximum Seated Height: .65 mm; |
| Datasheet | BGM681L11E6327XUSA1 Datasheet |
| In Stock | 793 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | UNSPECIFIED |
| Nominal Supply Voltage: | 2.8 V |
| Telecom IC Type: | TELECOM CIRCUIT |
| Maximum Seated Height: | .65 mm |
| Surface Mount: | YES |
| No. of Functions: | 1 |
| No. of Terminals: | 11 |
| Terminal Position: | UPPER |
| Package Style (Meter): | UNCASED CHIP |
| Length: | 2.5 mm |
| JESD-30 Code: | S-XUUC-N11 |
| Package Shape: | SQUARE |
| Terminal Form: | NO LEAD |
| Package Code: | DIE |
| Width: | 2.5 mm |
