BGS13BN14 by Infineon Technologies | Telecommunications

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Manufacturer	Infineon Technologies
Manufacturer's Part Number	BGS13BN14
Description	TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 14; Package Code: HVQCCN; Package Shape: SQUARE;
Datasheet	BGS13BN14 Datasheet
In Stock	76

NAME	DESCRIPTION
Package Body Material:	UNSPECIFIED
Nominal Supply Voltage:	3.5 V
Telecom IC Type:	TELECOM CIRCUIT
Maximum Seated Height:	.77 mm
Surface Mount:	YES
Terminal Finish:	MATTE TIN
JESD-609 Code:	e3
Minimum Operating Temperature:	-30 Cel
No. of Functions:	1
No. of Terminals:	14
Terminal Position:	QUAD
Package Style (Meter):	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Length:	1.6 mm
Technology:	CMOS
JESD-30 Code:	S-XQCC-N14
Package Shape:	SQUARE
Terminal Form:	NO LEAD
Maximum Operating Temperature:	85 Cel
Package Code:	HVQCCN
Width:	1.6 mm
Terminal Pitch:	.4 mm
Temperature Grade:	OTHER

Pricing (USD)

Qty.	Unit Price	Ext. Price
76	-	-

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