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| Manufacturer | Infineon Technologies |
|---|---|
| Manufacturer's Part Number | BGS16MN14E6327XTSA1 |
| Description | TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 14; Package Code: HVQCCN; Package Shape: SQUARE; |
| Datasheet | BGS16MN14E6327XTSA1 Datasheet |
| In Stock | 106 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 3.5 V |
| Maximum Time At Peak Reflow Temperature (s): | NOT SPECIFIED |
| Maximum Seated Height: | .77 mm |
| Surface Mount: | YES |
| Terminal Finish: | Tin (Sn) |
| No. of Terminals: | 14 |
| Terminal Position: | QUAD |
| Package Style (Meter): | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Technology: | CMOS |
| JESD-30 Code: | S-PQCC-N14 |
| Package Shape: | SQUARE |
| Terminal Form: | NO LEAD |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | HVQCCN |
| Width: | 2 mm |
| Moisture Sensitivity Level (MSL): | 1 |
| Telecom IC Type: | TELECOM CIRCUIT |
| JESD-609 Code: | e3 |
| Minimum Operating Temperature: | -30 Cel |
| No. of Functions: | 1 |
| Length: | 2 mm |
| Peak Reflow Temperature (C): | NOT SPECIFIED |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | OTHER |
