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| Manufacturer | Infineon Technologies |
|---|---|
| Manufacturer's Part Number | BGSF110GN26E6327XTSA1 |
| Description | TELECOM CIRCUIT; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 26; Package Code: HQCCN; Package Shape: RECTANGULAR; |
| Datasheet | BGSF110GN26E6327XTSA1 Datasheet |
| In Stock | 321,811 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 3 V |
| Telecom IC Type: | TELECOM CIRCUIT |
| Maximum Seated Height: | .77 mm |
| Surface Mount: | YES |
| Terminal Finish: | NICKEL PALLADIUM GOLD SILVER |
| JESD-609 Code: | e4 |
| Minimum Operating Temperature: | -30 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 26 |
| Terminal Position: | QUAD |
| Package Style (Meter): | CHIP CARRIER, HEAT SINK/SLUG |
| Length: | 3.4 mm |
| Technology: | CMOS |
| JESD-30 Code: | R-PQCC-N26 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | NO LEAD |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | HQCCN |
| Width: | 2.6 mm |
| Temperature Grade: | OTHER |
| Moisture Sensitivity Level (MSL): | 1 |
