Infineon Technologies - BGSX22GN10

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BGSX22GN10 by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number BGSX22GN10
Description RF AND BASEBAND CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: BUTT; No. of Terminals: 10; Package Code: BCC; Package Shape: RECTANGULAR;
Datasheet BGSX22GN10 Datasheet
In Stock561
NAME DESCRIPTION
Package Body Material: UNSPECIFIED
Nominal Supply Voltage: 2.6 V
Telecom IC Type: RF AND BASEBAND CIRCUIT
Maximum Seated Height: .4 mm
Surface Mount: YES
Minimum Operating Temperature: -40 Cel
No. of Functions: 1
No. of Terminals: 10
Terminal Position: BOTTOM
Package Style (Meter): CHIP CARRIER
Length: 1.5 mm
Technology: CMOS
JESD-30 Code: R-XBCC-B10
Package Shape: RECTANGULAR
Terminal Form: BUTT
Maximum Operating Temperature: 85 Cel
Package Code: BCC
Width: 1.1 mm
Terminal Pitch: .4 mm
Temperature Grade: INDUSTRIAL
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