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| Manufacturer | Infineon Technologies |
|---|---|
| Manufacturer's Part Number | BGSX24MU16E6327XUSA1 |
| Description | RF AND BASEBAND CIRCUIT; Terminal Form: NO LEAD; No. of Terminals: 16; Package Code: HLGA; Package Shape: SQUARE; Surface Mount: YES; |
| Datasheet | BGSX24MU16E6327XUSA1 Datasheet |
| In Stock | 32 |
| NAME | DESCRIPTION |
|---|---|
| Other Names: |
448-BGSX24MU16E6327XUSA1DKR 448-BGSX24MU16E6327XUSA1TR 2156-BGSX24MU16E6327XUSA1-448 448-BGSX24MU16E6327XUSA1CT SP004080430 |
| Package Body Material: | UNSPECIFIED |
| Nominal Supply Voltage: | 2.8 V |
| Telecom IC Type: | RF AND BASEBAND CIRCUIT |
| Maximum Seated Height: | .64 mm |
| Surface Mount: | YES |
| Minimum Operating Temperature: | -40 Cel |
| No. of Functions: | 1 |
| No. of Terminals: | 16 |
| Package Equivalence Code: | LGA16,5X5,16 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG |
| Length: | 2 mm |
| Technology: | RFCMOS |
| JESD-30 Code: | S-XBGA-N16 |
| Package Shape: | SQUARE |
| Terminal Form: | NO LEAD |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | HLGA |
| Width: | 2 mm |
| Terminal Pitch: | .4 mm |
| Moisture Sensitivity Level (MSL): | 3 |
