Infineon Technologies - BGT60

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BGT60 by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number BGT60
Description TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 119; Package Code: HBGA; Package Shape: SQUARE; Width: 6 mm;
Datasheet BGT60 Datasheet
In Stock533
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3.3 V
Telecom IC Type: TELECOM CIRCUIT
Maximum Seated Height: .8 mm
Surface Mount: YES
No. of Functions: 1
No. of Terminals: 119
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, HEAT SINK/SLUG
Length: 6 mm
Technology: CMOS
JESD-30 Code: S-PBGA-B119
Package Shape: SQUARE
Terminal Form: BALL
Package Code: HBGA
Width: 6 mm
Terminal Pitch: .5 mm
Moisture Sensitivity Level (MSL): 1
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