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| Manufacturer | Infineon Technologies |
|---|---|
| Manufacturer's Part Number | BGT60 |
| Description | TELECOM CIRCUIT; Terminal Form: BALL; No. of Terminals: 119; Package Code: HBGA; Package Shape: SQUARE; Width: 6 mm; |
| Datasheet | BGT60 Datasheet |
| In Stock | 533 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Nominal Supply Voltage: | 3.3 V |
| Telecom IC Type: | TELECOM CIRCUIT |
| Maximum Seated Height: | .8 mm |
| Surface Mount: | YES |
| No. of Functions: | 1 |
| No. of Terminals: | 119 |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, HEAT SINK/SLUG |
| Length: | 6 mm |
| Technology: | CMOS |
| JESD-30 Code: | S-PBGA-B119 |
| Package Shape: | SQUARE |
| Terminal Form: | BALL |
| Package Code: | HBGA |
| Width: | 6 mm |
| Terminal Pitch: | .5 mm |
| Moisture Sensitivity Level (MSL): | 1 |









