Infineon Technologies - CMY191

  1. Home
  2. Infineon Technologies - CMY191
CMY191 by Infineon Technologies

Image shown is a representation only.

Manufacturer Infineon Technologies
Manufacturer's Part Number CMY191
Description RF AND BASEBAND CIRCUIT; Terminal Form: GULL WING; No. of Terminals: 10; Package Code: TSSOP; Package Shape: SQUARE; Terminal Position: DUAL;
Datasheet CMY191 Datasheet
In Stock757
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Nominal Supply Voltage: 3 V
Telecom IC Type: RF AND BASEBAND CIRCUIT
Maximum Seated Height: 1.1 mm
Surface Mount: YES
No. of Functions: 1
No. of Terminals: 10
Qualification: Not Qualified
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Length: 3 mm
JESD-30 Code: S-PDSO-G10
Package Shape: SQUARE
Terminal Form: GULL WING
Package Code: TSSOP
Width: 3 mm
Terminal Pitch: .5 mm
Plant 5!
Your quote plants 5 trees.

Pricing (USD)

Qty. Unit Price Ext. Price
757 - -

Popular Products

Category Top Products

CC2400RSU by Texas Instruments

CC2400RSU

Texas Instruments

CC2400RSU by Texas Instruments is a cellphone IC with 48 terminals in a square chip carrier package. Operating temperature ranges from -40 to 85°C, suitable for industrial use. It features RF and baseband circuits, CMOS technology, and a nominal voltage of 1.8V for telecom applications.
TRF3710IRGZTG4 by Texas Instruments

TRF3710IRGZTG4

Texas Instruments

TRF3710IRGZTG4 by Texas Instruments is a cellphone IC with 48 terminals, operating at -40 to 85°C. It features a 5V supply voltage, RF and baseband circuit for telecom applications. The package style is chip carrier with very thin profile, suitable for surface mount assembly.
ST25R3911B-AQWT by STMicroelectronics

ST25R3911B-AQWT

STMicroelectronics

RF AND BASEBAND CIRCUIT; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3; Terminal Finish: MATTE TIN;
MAX2306ETI by Analog Devices

MAX2306ETI

Analog Devices

Analog Devices' MAX2306ETI is a cellphone IC with 28 terminals, operating at -40 to 85 °C. It has a supply voltage of 3/3.3V and low current draw of 0.0415mA. Ideal for baseband circuits in telecom applications due to its compact square chip carrier package design.
HMC422MS8TR by Analog Devices

HMC422MS8TR

Analog Devices

Analog Devices' HMC422MS8TR is a cellphone IC with 8 terminals in a small outline, thin profile package. It operates b/w -40 to 85 °C and has a nominal voltage of 3V. This RF and baseband circuit is ideal for telecom applications due to its compact size and dual terminal position.
MAX4003EBL-T by Maxim Integrated

MAX4003EBL-T

Maxim Integrated

MAX4003EBL-T by Maxim Integrated is a CELLPHONE IC with 8 terminals in a GRID ARRAY package. It operates b/w -40 to 85°C, suitable for RF and baseband circuits. With a very thin profile of 0.67mm, it has a terminal pitch of 0.5mm ideal for telecom applications.
TCM320AC56CDW by Texas Instruments

TCM320AC56CDW

Texas Instruments

TCM320AC56CDW by Texas Instruments is a 20-terminal cellphone IC with 5V power supply, operating b/w 0-70°C. It features a compact rectangular package style, companding law MU-LAW, and telecom IC type BASEBAND CIRCUIT. Ideal for applications requiring small outline packages and high gain tolerance.
LMV225URX by Texas Instruments

LMV225URX

Texas Instruments

LMV225URX by Texas Instruments is a cellphone IC with a package style of grid array, very thin profile, and fine pitch. It operates in industrial temperature grades from -40 to 85°C, suitable for RF and baseband circuits in telecom applications. The IC has a nominal voltage of 2.7V and features surface mount technology with tin lead terminal finish.
ADF4360-8BCPZRL7 by Analog Devices

ADF4360-8BCPZRL7

Analog Devices

Analog Devices' ADF4360-8BCPZRL7 is a cellphone IC with 24 terminals, BICMOS technology, and 3.3V supply voltage. It operates in industrial temperature range (-40 to 85°C) and has a square package suitable for surface mount applications. Ideal for baseband circuits in telecommunications due to its compact size (4x4mm) and low profile design (1mm).
ADF7021-VBCPZ by Analog Devices

ADF7021-VBCPZ

Analog Devices

Analog Devices' ADF7021-VBCPZ is a cellphone IC with 48 terminals, operating at -40 to 85°C. It features a supply voltage of 2.5/3.3V and telecom IC type for RF and baseband circuits. The chip carrier package style with a very thin profile makes it suitable for industrial applications requiring compact design and high performance in telecommunications systems.
SI4721-B20-GM by Silicon Labs

SI4721-B20-GM

Silicon Labs

SI4721-B20-GM by Silicon Labs is a cellphone IC with 20 terminals in a square package. Operating temp range -20 to 85°C, terminal pitch 0.5mm, and supply voltage 3.3V make it ideal for RF and baseband circuits in telecom applications.
CC2511F32RSP by Texas Instruments

CC2511F32RSP

Texas Instruments

CC2511F32RSP by Texas Instruments is a cellphone IC with 36 terminals in a square chip carrier package. Operating b/w 0-85°C, it features CMOS technology and RF/baseband circuitry for telecom applications. With a nominal voltage of 3.3V, this surface-mount IC has a terminal pitch of 0.5mm and low profile at 0.9mm seated height.
MAX2685EEE+T by Analog Devices

MAX2685EEE+T

Analog Devices

MAX2685EEE+T by Analog Devices is a 16-terminal cellphone IC in small outline package. With operating temp range of -40 to 85 °C, it's ideal for RF and baseband circuits. Features include matte tin finish, shrink pitch style, and 3V supply voltage.
CC2510F8RHHT by Texas Instruments

CC2510F8RHHT

Texas Instruments

CC2510F8RHHT by Texas Instruments is a cellphone IC with 36 terminals in a square chip carrier package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a supply voltage of 3V and terminal pitch of 0.5mm, making it ideal for telecommunications applications.
MAX2044ETP+ by Analog Devices

MAX2044ETP+

Analog Devices

MAX2044ETP+ by Analog Devices is a Cellphone IC with 20 terminals, operating at -40 to 85 °C. It features BICMOS technology, RF and baseband circuit for telecom applications, and requires 3.3V nominal voltage. The package style is chip carrier with a very thin profile, suitable for surface mount applications.
CC1110F16RSPR by Texas Instruments

CC1110F16RSPR

Texas Instruments

The Texas Instruments CC1110F16RSPR is a cellphone IC with 36 terminals in a square chip carrier package. It operates b/w -40 to 85°C, with a supply voltage of 3V. This RF and baseband circuit has a terminal pitch of 0.5mm and is suitable for industrial temperature grade applications.
ADRV9010BBCZ by Analog Devices

ADRV9010BBCZ

Analog Devices

Analog Devices' ADRV9010BBCZ is a cellphone IC with 289 terminals in a low profile, fine pitch grid array package. It operates b/w -40 °C to 110°C and has a terminal pitch of 0.8mm. Ideal for RF and baseband circuits in telecommunications applications due to its 1V supply voltage requirement.
CC1100ERGPR by Texas Instruments

CC1100ERGPR

Texas Instruments

CC1100ERGPR by Texas Instruments is a cellphone IC with 20 terminals, operating at temperatures from -40 to 85°C. It features a CMOS technology, RF and baseband circuit for data rates up to 0.5 Mbps. This chip carrier package with nickel palladium gold finish is ideal for industrial telecom applications.
ADL5502ACBZ-P2 by Analog Devices

ADL5502ACBZ-P2

Analog Devices

ADL5502ACBZ-P2 by Analog Devices is a BICMOS technology Cellphone IC with 8 terminals in a square grid array package. It operates b/w -40 to 85°C, suitable for RF and baseband circuits in telecom applications. The package has a very thin profile, measures 1.46mm in width and length, with terminal pitch of 0.5mm.
TRF6901PTG4 by Texas Instruments

TRF6901PTG4

Texas Instruments

TRF6901PTG4 by Texas Instruments is a cellphone IC with 48 terminals in a square package. It operates b/w -40 to 85°C, suitable for industrial use. This RF and baseband circuit has a nominal voltage of 2.7V, making it ideal for telecom applications.