Infineon Technologies - CY14B116M-BZ45XIT

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CY14B116M-BZ45XIT by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number CY14B116M-BZ45XIT
Description NON-VOLATILE SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 165; Package Code: BGA; Package Shape: RECTANGULAR; Memory Density: 16777216 bit;
Datasheet CY14B116M-BZ45XIT Datasheet
In Stock825
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .00075 Amp
Organization: 1MX16
Sub-Category: SRAMs
Surface Mount: YES
Maximum Supply Current: 95 mA
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 165
No. of Words: 1048576 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
JESD-30 Code: R-PBGA-B165
Package Shape: RECTANGULAR
Terminal Form: BALL
Maximum Operating Temperature: 85 Cel
Package Code: BGA
Moisture Sensitivity Level (MSL): 3
Memory Density: 16777216 bit
Memory IC Type: NON-VOLATILE SRAM
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Memory Width: 16
Qualification: Not Qualified
Package Equivalence Code: BGA165,11X15,40
Maximum Access Time: 45 ns
No. of Words Code: 1M
Peak Reflow Temperature (C): 260
Terminal Pitch: 1 mm
Temperature Grade: INDUSTRIAL
Power Supplies (V): 3/3.3
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