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| Manufacturer | Infineon Technologies |
|---|---|
| Manufacturer's Part Number | CY61257R2XXXV0-25ZAC |
| Description | MEMORY CIRCUIT; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: TSSOP; Package Shape: RECTANGULAR; Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH; |
| Datasheet | CY61257R2XXXV0-25ZAC Datasheet |
| In Stock | 256 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .000001 Amp |
| Mixed Memory Type: | ROM+SRAM |
| Sub-Category: | Other Memory ICs |
| Surface Mount: | YES |
| Maximum Supply Current: | 6 mA |
| Memory IC Type: | MEMORY CIRCUIT |
| Terminal Finish: | Tin/Lead (Sn/Pb) |
| JESD-609 Code: | e0 |
| Minimum Operating Temperature: | 0 Cel |
| No. of Terminals: | 32 |
| Qualification: | Not Qualified |
| Package Equivalence Code: | TSSOP32,.56,20 |
| Terminal Position: | DUAL |
| Package Style (Meter): | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Technology: | CMOS |
| JESD-30 Code: | R-PDSO-G32 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | GULL WING |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | TSSOP |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | COMMERCIAL |
| Power Supplies (V): | 1.8/3.3 |
