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Manufacturer | Infineon Technologies |
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Manufacturer's Part Number | CY7C09579V-100BBXC |
Description | MULTI-PORT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 172; Package Code: LBGA; Package Shape: SQUARE; No. of Functions: 1; |
Datasheet | CY7C09579V-100BBXC Datasheet |
In Stock | 367 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Organization: | 32KX36 |
Maximum Time At Peak Reflow Temperature (s): | 40 |
Maximum Seated Height: | 1.25 mm |
Minimum Supply Voltage (Vsup): | 3.135 V |
Surface Mount: | YES |
Terminal Finish: | TIN SILVER COPPER |
No. of Terminals: | 172 |
No. of Words: | 32768 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, LOW PROFILE |
Technology: | CMOS |
JESD-30 Code: | S-PBGA-B172 |
Package Shape: | SQUARE |
Terminal Form: | BALL |
Operating Mode: | SYNCHRONOUS |
Maximum Operating Temperature: | 70 Cel |
Package Code: | LBGA |
Width: | 15 mm |
Moisture Sensitivity Level (MSL): | 3 |
Memory Density: | 1179648 bit |
Memory IC Type: | MULTI-PORT SRAM |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | 0 Cel |
Memory Width: | 36 |
No. of Functions: | 1 |
Length: | 15 mm |
Maximum Access Time: | 12.5 ns |
No. of Words Code: | 32K |
Nominal Supply Voltage / Vsup (V): | 3.3 |
Additional Features: | FLOW-THROUGH OR PIPELINED ARCHITECTURE |
Peak Reflow Temperature (C): | 260 |
Parallel or Serial: | PARALLEL |
Terminal Pitch: | 1 mm |
Temperature Grade: | COMMERCIAL |
Maximum Supply Voltage (Vsup): | 3.465 V |