CY7C1360C-200BGCT by Infineon Technologies | Memory ICs

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Manufacturer	Infineon Technologies
Manufacturer's Part Number	CY7C1360C-200BGCT
Description	STANDARD SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 119; Package Code: BGA; Package Shape: RECTANGULAR; Power Supplies (V): 2.5/3.3,3.3;
Datasheet	CY7C1360C-200BGCT Datasheet
In Stock	201

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Maximum Standby Current:	.04 Amp
Organization:	256KX36
Output Characteristics:	3-STATE
Sub-Category:	SRAMs
Surface Mount:	YES
Maximum Supply Current:	220 mA
Terminal Finish:	TIN LEAD
No. of Terminals:	119
Maximum Clock Frequency (fCLK):	200 MHz
No. of Words:	262144 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY
Technology:	CMOS
JESD-30 Code:	R-PBGA-B119
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	70 Cel
Package Code:	BGA
Moisture Sensitivity Level (MSL):	3
Input/Output Type:	COMMON
Memory Density:	9437184 bit
Minimum Standby Voltage:	3.14 V
Memory IC Type:	STANDARD SRAM
JESD-609 Code:	e0
Minimum Operating Temperature:	0 Cel
Memory Width:	36
Qualification:	Not Qualified
Package Equivalence Code:	BGA119,7X17,50
Maximum Access Time:	3 ns
No. of Words Code:	256K
Peak Reflow Temperature (C):	220
Parallel or Serial:	PARALLEL
Terminal Pitch:	1.27 mm
Temperature Grade:	COMMERCIAL
Power Supplies (V):	2.5/3.3,3.3

Pricing (USD)

Qty.	Unit Price	Ext. Price
201	-	-

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N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Package Shape: RECTANGULAR;