Infineon Technologies - CY7C1370KV25-200BZC

CY7C1370KV25-200BZC by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number CY7C1370KV25-200BZC
Description ZBT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 165; Package Code: LBGA; Package Shape: RECTANGULAR; Maximum Operating Temperature: 70 Cel;
Datasheet CY7C1370KV25-200BZC Datasheet
In Stock208
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 512KX36
Maximum Time At Peak Reflow Temperature (s): 20
Maximum Seated Height: 1.4 mm
Minimum Supply Voltage (Vsup): 2.375 V
Surface Mount: YES
Terminal Finish: TIN LEAD
No. of Terminals: 165
No. of Words: 524288 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE
Technology: CMOS
JESD-30 Code: R-PBGA-B165
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: LBGA
Width: 13 mm
Moisture Sensitivity Level (MSL): 3
Memory Density: 18874368 bit
Memory IC Type: ZBT SRAM
JESD-609 Code: e0
Minimum Operating Temperature: 0 Cel
Memory Width: 36
No. of Functions: 1
Length: 15 mm
Maximum Access Time: 3 ns
No. of Words Code: 512K
Nominal Supply Voltage / Vsup (V): 2.5
Additional Features: PIPELINED ARCHITECTURE
Peak Reflow Temperature (C): 260
Parallel or Serial: PARALLEL
Terminal Pitch: 1 mm
Temperature Grade: COMMERCIAL
Maximum Supply Voltage (Vsup): 2.625 V
Plant 5!
Your quote plants 5 trees.

Pricing (USD)

Qty. Unit Price Ext. Price
208 $11.060 $2,300.480

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