Infineon Technologies - CY7C1372B-166BGC

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CY7C1372B-166BGC by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number CY7C1372B-166BGC
Description ZBT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 119; Package Code: BGA; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;
Datasheet CY7C1372B-166BGC Datasheet
In Stock986
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Maximum Standby Current: .03 Amp
Organization: 1MX18
Output Characteristics: 3-STATE
Sub-Category: SRAMs
Surface Mount: YES
Maximum Supply Current: 230 mA
Terminal Finish: Tin/Lead (Sn/Pb)
No. of Terminals: 119
Maximum Clock Frequency (fCLK): 166 MHz
No. of Words: 1048576 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: R-PBGA-B119
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: BGA
Input/Output Type: COMMON
Memory Density: 18874368 bit
Minimum Standby Voltage: 3.14 V
Memory IC Type: ZBT SRAM
JESD-609 Code: e0
Minimum Operating Temperature: 0 Cel
Memory Width: 18
Qualification: Not Qualified
Package Equivalence Code: BGA119,7X17,50
Maximum Access Time: 3.4 ns
No. of Words Code: 1M
Parallel or Serial: PARALLEL
Terminal Pitch: 1.27 mm
Temperature Grade: COMMERCIAL
Power Supplies (V): 2.5/3.3,3.3
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