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| Manufacturer | Infineon Technologies |
|---|---|
| Manufacturer's Part Number | CY7C1412KV18-300BZXC |
| Description | QDR SRAM; No. of Terminals: 165; Package Code: LBGA; Package Shape: RECTANGULAR; Maximum Standby Current: .27 Amp; Additional Features: PIPELINED ARCHITECTURE; |
| Datasheet | CY7C1412KV18-300BZXC Datasheet |
| In Stock | 256 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | PLASTIC/EPOXY |
| Maximum Standby Current: | .27 Amp |
| Organization: | 2MX18 |
| Output Characteristics: | 3-STATE |
| Maximum Time At Peak Reflow Temperature (s): | 30 |
| Maximum Seated Height: | 1.4 mm |
| Minimum Supply Voltage (Vsup): | 1.7 V |
| Surface Mount: | YES |
| Maximum Supply Current: | 700 mA |
| Terminal Finish: | TIN SILVER COPPER |
| No. of Terminals: | 165 |
| Maximum Clock Frequency (fCLK): | 300 MHz |
| No. of Words: | 2097152 words |
| Terminal Position: | BOTTOM |
| Package Style (Meter): | GRID ARRAY, LOW PROFILE |
| Technology: | CMOS |
| JESD-30 Code: | R-PBGA-B165 |
| Package Shape: | RECTANGULAR |
| Terminal Form: | BALL |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 70 Cel |
| Package Code: | LBGA |
| Width: | 13 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Input/Output Type: | SEPARATE |
| Memory Density: | 37748736 bit |
| Minimum Standby Voltage: | 1.7 V |
| Memory IC Type: | QDR SRAM |
| JESD-609 Code: | e1 |
| Minimum Operating Temperature: | 0 Cel |
| Memory Width: | 18 |
| Output Enable: | NO |
| No. of Functions: | 1 |
| Package Equivalence Code: | BGA165,11X15,40 |
| Length: | 15 mm |
| Maximum Access Time: | .45 ns |
| No. of Words Code: | 2M |
| Nominal Supply Voltage / Vsup (V): | 1.8 |
| Additional Features: | PIPELINED ARCHITECTURE |
| Peak Reflow Temperature (C): | 260 |
| Parallel or Serial: | PARALLEL |
| Terminal Pitch: | 1 mm |
| Maximum Supply Voltage (Vsup): | 1.9 V |
