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Manufacturer | Infineon Technologies |
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Manufacturer's Part Number | CY7C1470V25-200BZXC |
Description | ZBT SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 165; Package Code: LBGA; Package Shape: RECTANGULAR; Maximum Supply Current: 450 mA; |
Datasheet | CY7C1470V25-200BZXC Datasheet |
In Stock | 712 |
NAME | DESCRIPTION |
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Package Body Material: | PLASTIC/EPOXY |
Organization: | 2MX36 |
Output Characteristics: | 3-STATE |
Maximum Time At Peak Reflow Temperature (s): | 20 |
Maximum Seated Height: | 1.4 mm |
Minimum Supply Voltage (Vsup): | 2.375 V |
Sub-Category: | SRAMs |
Surface Mount: | YES |
Maximum Supply Current: | 450 mA |
Terminal Finish: | TIN SILVER COPPER |
No. of Terminals: | 165 |
Maximum Clock Frequency (fCLK): | 200 MHz |
No. of Words: | 2097152 words |
Terminal Position: | BOTTOM |
Package Style (Meter): | GRID ARRAY, LOW PROFILE |
Technology: | CMOS |
JESD-30 Code: | R-PBGA-B165 |
Package Shape: | RECTANGULAR |
Terminal Form: | BALL |
Operating Mode: | SYNCHRONOUS |
Maximum Operating Temperature: | 70 Cel |
Package Code: | LBGA |
Width: | 15 mm |
Moisture Sensitivity Level (MSL): | 3 |
Input/Output Type: | COMMON |
Memory Density: | 75497472 bit |
Minimum Standby Voltage: | 2.38 V |
Memory IC Type: | ZBT SRAM |
JESD-609 Code: | e1 |
Minimum Operating Temperature: | 0 Cel |
Memory Width: | 36 |
No. of Functions: | 1 |
Qualification: | Not Qualified |
Package Equivalence Code: | BGA165,11X15,40 |
Length: | 17 mm |
Maximum Access Time: | 3 ns |
No. of Words Code: | 2M |
Nominal Supply Voltage / Vsup (V): | 2.5 |
Additional Features: | PIPELINED ARCHITECTURE |
Peak Reflow Temperature (C): | 260 |
Parallel or Serial: | PARALLEL |
Terminal Pitch: | 1 mm |
Temperature Grade: | COMMERCIAL |
Maximum Supply Voltage (Vsup): | 2.625 V |
Power Supplies (V): | 1.8/2.5,2.5 |