CY7C1568KV18BZXI by Infineon Technologies | Memory ICs

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Manufacturer	Infineon Technologies
Manufacturer's Part Number	CY7C1568KV18BZXI
Description	DDR SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 165; Package Code: LBGA; Package Shape: RECTANGULAR; Moisture Sensitivity Level (MSL): 3;
Datasheet	CY7C1568KV18BZXI Datasheet
In Stock	708

NAME	DESCRIPTION
Package Body Material:	PLASTIC/EPOXY
Organization:	4MX18
Maximum Seated Height:	1.4 mm
Minimum Supply Voltage (Vsup):	1.7 V
Surface Mount:	YES
Terminal Finish:	TIN SILVER COPPER
No. of Terminals:	165
No. of Words:	4194304 words
Terminal Position:	BOTTOM
Package Style (Meter):	GRID ARRAY, LOW PROFILE
Technology:	CMOS
JESD-30 Code:	R-PBGA-B165
Package Shape:	RECTANGULAR
Terminal Form:	BALL
Operating Mode:	SYNCHRONOUS
Maximum Operating Temperature:	85 Cel
Package Code:	LBGA
Width:	13 mm
Moisture Sensitivity Level (MSL):	3
Memory Density:	75497472 bit
Memory IC Type:	DDR SRAM
JESD-609 Code:	e1
Minimum Operating Temperature:	-40 Cel
Memory Width:	18
No. of Functions:	1
Length:	15 mm
Maximum Access Time:	.45 ns
No. of Words Code:	4M
Nominal Supply Voltage / Vsup (V):	1.8
Additional Features:	PIPELINED ARCHITECTURE
Parallel or Serial:	PARALLEL
Terminal Pitch:	1 mm
Temperature Grade:	INDUSTRIAL
Maximum Supply Voltage (Vsup):	1.9 V

Pricing (USD)

Qty.	Unit Price	Ext. Price
708	-	-

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