Infineon Technologies - CY7C1614KV18-300BZXC

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CY7C1614KV18-300BZXC by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number CY7C1614KV18-300BZXC
Description QDR SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 165; Package Code: BGA; Package Shape: RECTANGULAR; Additional Features: PIPELINED ARCHITECTURE;
Datasheet CY7C1614KV18-300BZXC Datasheet
In Stock795
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 4MX36
Minimum Supply Voltage (Vsup): 1.7 V
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 165
No. of Words: 4194304 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: R-PBGA-B165
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: BGA
Memory Density: 150994944 bit
Memory IC Type: QDR SRAM
JESD-609 Code: e1
Minimum Operating Temperature: 0 Cel
Memory Width: 36
No. of Functions: 1
Qualification: Not Qualified
No. of Words Code: 4M
Nominal Supply Voltage / Vsup (V): 1.8
Additional Features: PIPELINED ARCHITECTURE
Parallel or Serial: PARALLEL
Temperature Grade: COMMERCIAL
Maximum Supply Voltage (Vsup): 1.9 V
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