Infineon Technologies - CY7C1625KV18-333BZXI

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CY7C1625KV18-333BZXI by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number CY7C1625KV18-333BZXI
Description QDR SRAM; Temperature Grade: INDUSTRIAL; No. of Terminals: 165; Package Code: BGA; Package Shape: RECTANGULAR; Parallel or Serial: PARALLEL;
Datasheet CY7C1625KV18-333BZXI Datasheet
In Stock625
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 16MX9
Minimum Supply Voltage (Vsup): 1.7 V
Surface Mount: YES
Terminal Finish: TIN SILVER COPPER
No. of Terminals: 165
No. of Words: 16777216 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY
Technology: CMOS
JESD-30 Code: R-PBGA-B165
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 85 Cel
Package Code: BGA
Memory Density: 150994944 bit
Memory IC Type: QDR SRAM
JESD-609 Code: e1
Minimum Operating Temperature: -40 Cel
Memory Width: 9
No. of Functions: 1
Qualification: Not Qualified
No. of Words Code: 16M
Nominal Supply Voltage / Vsup (V): 1.8
Additional Features: PIPELINED ARCHITECTURE
Parallel or Serial: PARALLEL
Temperature Grade: INDUSTRIAL
Maximum Supply Voltage (Vsup): 1.9 V
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