Infineon Technologies - CY7C2263KV18-500BZXC

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CY7C2263KV18-500BZXC by Infineon Technologies

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Manufacturer Infineon Technologies
Manufacturer's Part Number CY7C2263KV18-500BZXC
Description QDR SRAM; Temperature Grade: COMMERCIAL; No. of Terminals: 165; Package Code: LBGA; Package Shape: RECTANGULAR; Terminal Form: BALL;
Datasheet CY7C2263KV18-500BZXC Datasheet
In Stock949
NAME DESCRIPTION
Package Body Material: PLASTIC/EPOXY
Organization: 2MX18
Maximum Time At Peak Reflow Temperature (s): 30
Maximum Seated Height: 1.4 mm
Minimum Supply Voltage (Vsup): 1.7 V
Surface Mount: YES
Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)
No. of Terminals: 165
No. of Words: 2097152 words
Terminal Position: BOTTOM
Package Style (Meter): GRID ARRAY, LOW PROFILE
Technology: CMOS
JESD-30 Code: R-PBGA-B165
Package Shape: RECTANGULAR
Terminal Form: BALL
Operating Mode: SYNCHRONOUS
Maximum Operating Temperature: 70 Cel
Package Code: LBGA
Width: 13 mm
Moisture Sensitivity Level (MSL): 3
Memory Density: 37748736 bit
Memory IC Type: QDR SRAM
JESD-609 Code: e1
Minimum Operating Temperature: 0 Cel
Memory Width: 18
No. of Functions: 1
Length: 15 mm
No. of Words Code: 2M
Nominal Supply Voltage / Vsup (V): 1.8
Additional Features: PIPELINED ARCHITECTURE
Peak Reflow Temperature (C): 260
Parallel or Serial: PARALLEL
Terminal Pitch: 1 mm
Temperature Grade: COMMERCIAL
Maximum Supply Voltage (Vsup): 1.9 V
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