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| Manufacturer | Infineon Technologies |
|---|---|
| Manufacturer's Part Number | CY8C20110-LDX2I |
| Description | MEMORY CIRCUIT; Temperature Grade: INDUSTRIAL; No. of Terminals: 16; Package Code: VQCCN; Package Shape: SQUARE; Minimum Supply Voltage (Vsup): 2.4 V; |
| Datasheet | CY8C20110-LDX2I Datasheet |
| In Stock | 604 |
| NAME | DESCRIPTION |
|---|---|
| Package Body Material: | UNSPECIFIED |
| Organization: | 2KX1 |
| Maximum Time At Peak Reflow Temperature (s): | 20 |
| Maximum Seated Height: | .6 mm |
| Minimum Supply Voltage (Vsup): | 2.4 V |
| Surface Mount: | YES |
| Terminal Finish: | Nickel/Palladium/Gold (Ni/Pd/Au) |
| No. of Terminals: | 16 |
| No. of Words: | 2048 words |
| Terminal Position: | QUAD |
| Package Style (Meter): | CHIP CARRIER, VERY THIN PROFILE |
| Technology: | CMOS |
| JESD-30 Code: | S-XQCC-N16 |
| Package Shape: | SQUARE |
| Terminal Form: | NO LEAD |
| Operating Mode: | SYNCHRONOUS |
| Maximum Operating Temperature: | 85 Cel |
| Package Code: | VQCCN |
| Width: | 3 mm |
| Moisture Sensitivity Level (MSL): | 3 |
| Memory Density: | 2048 bit |
| Memory IC Type: | MEMORY CIRCUIT |
| JESD-609 Code: | e4 |
| Minimum Operating Temperature: | -40 Cel |
| Memory Width: | 1 |
| No. of Functions: | 1 |
| Qualification: | Not Qualified |
| Length: | 3 mm |
| No. of Words Code: | 2K |
| Nominal Supply Voltage / Vsup (V): | 3 |
| Additional Features: | SRAM IS ORGANISED AS 512MB |
| Peak Reflow Temperature (C): | 260 |
| Terminal Pitch: | .5 mm |
| Temperature Grade: | INDUSTRIAL |
| Maximum Supply Voltage (Vsup): | 5.25 V |
